Printed circuit board assembly, also known as PCB assembly or PCBA, is the process of mounting various electronic components to a PCB. A circuit board prior to assembly of electronic components is known as PCB. Once electronic components are soldered, the board is called Printed Circuit Board Assembly (PCBA). The traces or conductive pathways engraved in the laminated copper sheets of PCBs are used within a non-conductive substrate in order to form the assembly. Attaching the electronic components with the printed circuit boards is the concluding action before using the fully operational electronic device.

Topscom Technology offers one-stop high-quality, yet affordable PCB assembly (PCBA) services that include PCB manufacture, components procurement and assembly all-in-one. With over ten years' of industrial experience, the service is ideal for engineering firms, makers, Kickstarter projects, and students for applications including aviation, medical, telecommunications, IOT, consumer electronics and more. Get an instant quote online in seconds with no hidden costs and no strings attached. Topscom PCBA capabilities: SMT Assembly, BGA Assembly, Through-Hole Assembly, Mixed Assembly, Rigid Flex PCB assembly Services. Compliant with a wide range of standards including IPC 610 Class 2 and Class 3.

Prototype PCB Assembly as Quick as 1 Day
Our printed circuit board assembly service is China’s leading one-stop solution for PCB and assembly under one roof; specializing in small and medium runs with fast lead-times and no minimum quantity requirements.

A Seamless Process from PCB to Assembly
All printed circuit boards assembled by Topscom Technology are made by Topscom and we maintain full control of the entire process so you don't have to manage multiple vendors.  When you choose Topscom Technology, you can be sure that your PCBs flow directly into our in-house Assembly Department to begin assembly without delay.
Advanced Capabilities

PCB assembly capabilities include Surface Mount Technology (SMT), Thru-hole, and mixed technology (SMT with Thru-hole) for single and double-sided placement.  We support Fine Pitch components as small as 15 mil pitch, Passive Components as small as 0201 package, Ball Grid Arrays (BGA) as small as .4mm pitch with X-Ray inspected placements, and more.