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PCB products, regardless of rigid, flexible, rigid-flex bonding multilayers, as well as module substrates for IC packaging substrates, make a great contribution to high-end electronic equipment. PCB industry plays an important role in electronic interconnection technology.
 
Recalling the difficult course of China's PCB over the past 50 years, today it has written a brilliant page in the history of the development of PCB in the world. In 2006, the output value of PCB in China is nearly 13 billion US dollars, which is called the largest producer of PCB in the world.
 
According to the current development trend of PCB technology:
 
 
1. Develop along the road of high-density interconnection technology (HDI).
 
Because HDI embodies the most advanced technology of contemporary PCB, it brings fine wiring and micro-aperture to PCB. Mobile phone (mobile phone), one of the electronic products of HDI multilayer board application terminal, is a model of HDI cutting-edge development technology. In the mobile phone, the PCB motherboard micro wire (50 μ m ~ 75 μ m / 50 μ m ~ 75 μ m, wire width / spacing) has become the mainstream, in addition, the conductive layer and plate thickness are thinned, and the conductive pattern is refined, which brings high density and high performance of electronic equipment.
 
 
 
2, component embedding technology has strong vitality.
 
The functions of semiconductor devices (called active components), electronic components (called passive components) or passive components formed in the inner layer of PCB "component embedding PCB" has begun to be mass-produced. Component embedding technology is a great change in PCB functional integrated circuits, but in order to develop, analog design methods must be solved, production technology, quality inspection and reliability assurance is an urgent task.
 
We need to invest more resources in the system, including design, equipment, testing and simulation, in order to maintain strong vitality.
 
 
 
3, if you want to develop materials in PCB, please climb to another high-rise building.
 
Whether rigid PCB or flexible PCB materials, with the lead-free of global electronic products, it is necessary to make these materials have higher heat resistance. Therefore, new materials with high Tg, low coefficient of thermal expansion, small dielectric constant and dielectric loss tangent continue to emerge.
 
 
 
4. Optoelectronic PCB has a broad prospect.
 
It uses the optical layer and the circuit layer to transmit signals. The key of this new technology is to manufacture the optical layer (optical waveguide layer). It is a kind of organic polymer, which is formed by lithography, laser ablation, reactive ion etching and so on. At present, the technology has been industrialized in Japan and the United States.
 
 
 
5, the manufacturing process should be updated and advanced equipment should be introduced.
 
1. Manufacturing process.
 
HDI manufacturing has matured and tends to be perfected. With the development of PCB technology, although the commonly used subtraction manufacturing methods are still dominant, low-cost processes such as addition and semi-addition have begun to rise.
 
Using nanotechnology to metallize the holes and form PCB conductive patterns at the same time, a new process for manufacturing flexible plates is developed.
 
High reliability, high quality printing method, inkjet PCB process.
 
 
2. Advanced equipment.
 
Production of fine wires, new high-resolution photo-induced masks and exposure devices, and laser direct exposure devices.
 
Uniform plating equipment.
 
Production components embedded (passive active components) manufacture and install equipment and facilities.