Electronics products full system integration box build assembly research.
 
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Abstract: the full system integration box build assembly process is the process of assembling various electronic components, pcb circuit boards  , enclosure and other components according to certain technological requirements and debugging to form complete electronic products with certain functions.
 


Keywords: process, pcb assembly, components, debugging, parameters,pcb boards.
 
1 characteristics and methods of assembly of the full system integration box build.
 
The main characteristics of assembly are as follows: (1) assembly is a combination of welding, assembly, debugging and other steps; (2) the quality is difficult to control in the process of assembly, such as judging welding quality only by experience, judging the assembly quality of switches by hand, etc.; (3) there are differences among the assembly staff. The assembly method is aimed at the specific product, analyze the assembly scheme and choose the best one. The common assembly methods are: (1) functional method; (2) component method; (3) functional component method. article is posted by Topscom,manufacturing process R&D Dep.Dr.Lee xueming,Topscom provide professional pcb boards design,pcb assembly,turnkey electronic contract manufacturing services.
 
2 assembly of printed pcb circuit boards  .
 
The installation of electronic components on the circuit board can be divided into two types: machine installation and manual installation. Manual installation is simple and easy, but the misinstallation rate is high, the efficiency is low, the machine installation speed is fast, the misinstallation rate is low, but the lead forming requirements are strict, and the equipment cost is high. Common installation forms are: (1) pasteboard installation. It is suitable for products with high shockproof requirements. The electronic components are close to the circuit board. If it is an electronic component with a metal shell and there are copper foil conductors on the surface of the circuit board, there should be an insulating pad or insulating sleeve. (2) suspended installation. It is suitable for the installation of heating elements. There should be a certain distance between the electronic components and the circuit board, which is usually about 4 ~ 7mm. (3) Vertical installation. It is common in pcb circuit boards   with dense electronic components. (4) buried installation. The installation height is low, and the anti-seismic capacity of electronic components is low. The shell of electronic components is buried in the hole of the circuit board, also known as embedded installation. (5) installation with height restrictions. The height limit installation of electronic components is generally inserted vertically and then tilted horizontally to reduce the height. In order to ensure the shock resistance of high-quality electronic components, it is necessary to do treatment to ensure that they have sufficient mechanical strength. (6) fixed installation of the bracket. For example, transformers, relays, etc., are often fixed with metal brackets.

 

3 assembly process.
 
3.1 Assembly principles for electronic products.
 
The basic principle of electronic product installation is: the front process shall not affect the installation of the following process, first inside then outside, first light then heavy, first riveted and then installed, fragile after installation.
 
3.2 basic process requirements for assembly and general installation process.
 
3.2.1 basic process requirements for machine assembly.
(1) correct assembly: (1) do not assemble unqualified installation parts; (2) pay attention to the safety requirements of installation components; (3) choose appropriate fastening tools to master the correct fastening method and appropriate fastening torque; (4) do not damage electronic components in the process of assembly; (5) strictly abide by the general order of installation, pay attention to the connection of the process to prevent the process from being reversed; (6) the operation skills should be skillfully mastered and the regulations of three tests (self-inspection, mutual inspection and full-time inspection) should be strictly carried out.

(2) protect the appearance of the products: (1) prevent printed pcb circuit boards   and plastic parts from being stained with oil and sweat, and the station operators should wear gloves to operate; (2) handle the plastic vulnerable parts such as shell and panel with care. The workbench should be provided with cushions to prevent plastic parts from scrubbing; (3) station operators using electric iron should be careful not to damage plastic parts such as enclosure and panels; and (4) when using adhesives, they should prevent contamination and damage to the shell.

3.2.2 General technological process of machine assembly.

The assembly process is an important means to ensure that the technical standards of the full system integration box build are met. Skillfully apply the knowledge of common components and materials and assembly process knowledge to improve the operation skills in the assembly process. The assembly process of the full system integration box build is due to the use of.
 
With different equipment and tools and different specifications, the assembly processes of different products are different, but they are basically the same. The following picture shows the assembly process of the radio. article is posted by Topscom,manufacturing process R&D Dep.Dr.Lee xueming,Topscom provide professional pcb boards design,pcb assembly,turnkey electronic contract manufacturing services.
 
3.2.3 Electrostatic protection.

(1) the harm of static electricity. In the manufacturing process of electronic products, static electricity is produced due to friction, and the voltage of static electricity is about 0.5 ~ 2kV. The breakdown damage of electronic components caused by static electricity is the most common and serious harm. Too high electrostatic voltage causes breakdown and damage of components, or reduces the performance of components.

(2) the protection method of static electricity. The electronic components sensitive to static electricity are mainly semiconductor devices. In the production process of electronic products, avoiding the generation of static electricity is the best way to protect the electrostatic sensitive electronic components. To form an electrostatic safety zone, it should include electrostatic pads, special ground wires and anti-static wristbands.




4 Electrical connection.

The connection of the components of electronic products is realized through the connection of cables, wires and connectors. The direction, color, length, specification and type of cable of the wire shall be carried out in accordance with the provisions of the process document. Wiring technology. Wiring technology is an important link in the final assembly of the full system integration box build. The wiring of the full system integration box build is carried out according to the requirements of the process card guidance documents such as wiring diagram, wire table and so on. It is necessary to choose the wire reasonably. AVR type PVC insulated flexible cord is commonly used in the wiring of the full system integration box build, in which the current density is 2 ~ 5A zigmm, depending on the heat dissipation of the wire laying. The commonly used wire specifications are 1 × 7 / 0.15,
There are several kinds, such as 1 × 12 / 0.15, 1 × 16ax 0.15, etc. (specification: number of wires * number of core strands / wire diameter per strand). The color of the wire can be referred to in the following table.

5 debugging of the full system integration box build box build.

(1) the main contents of debugging work. Electronic products have adjustable components such as trimming capacitors, potentiometers, inductance coil cores, mechanical transmission parts and so on. The main contents of debugging are as follows: 1 be familiar with the debugging purpose and requirements of the product. (2) correctly and reasonably select and use the required instruments. (3) debug the unit circuit or the full system integration box build in strict accordance with the requirements of debugging process. After debugging, it is fixed by the method of painting and sealing wax. (4) correctly process and analyze the debugging data and eliminate the faults occurred in the debugging.

(2) the general program for debugging the full system integration box build. Due to different electronic products, the specific debugging is also different. The general procedures for debugging are: power supply debugging, functional circuit debugging, parameter testing, ambient temperature test, parameter correction. 1 debug the power supply. The debugging of the power supply is divided into three steps: the no-load initial adjustment of the power supply, the fine adjustment under the equivalent load, and the fine adjustment under the real load. (2) debugging of functional circuit. Each unit circuit is debugged in turn. 3Parametric test. After the adjustable components are adjusted, the debugging of the circuit is completed, and all the parameters of the product should be tested. 4Ambient temperature test. Test the ability of electronic products to work properly in a certain environment. (5) the parameters of the full system integration box build are adjusted again. After debugging the full system integration box build, the parameters may change, and the parameters will be adjusted again to make the full system integration box build in the best parameter state.